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本书由倒装芯片技术领域世界级专家撰写而成,系统总结了过去十几年倒装芯片相关技术的发展脉络和最新成果,并对倒装芯片技术未来的发展趋势做出了展望。内容涵盖倒装芯片的市场与技术趋势、凸点技术、互连技术...