PROCEEDINGS 1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING
2222 年出版547 页ISBN:0780348508
The packaging development process a guide for engineers and project managers
KristineDeMariaandtheronw.downes2000 年出版101 页ISBN:1566768012
MICROELECTRONIC PACKAGING TECHNOLOGY Materials and Processes Proceedings of the 2nd ASM INTERNATIONA
Wei T.Shieh1989 年出版479 页ISBN:
PACKAGING THE PRESIDENCY A HISTOTY AND CRITICISM OF PRESIDENTIAL CAMPAIGN ADVERTISING SECOND EDITO
1984 年出版546 页ISBN:0195072995
Bussiness ratio report: an industry sector analysis: food processing and packaging machinery industr
1986 年出版122 页ISBN:0862618924